curamik development milestones

1983 The company is founded with three employees and a plant area of 800 sqm.
1986 Start of Al2O3 DBC production.
1990 Sales start in the U.S. and first plant extension in Eschenbach to 1,500 sqm.
1992 Start of DBC production with multiple up.
1993 Start of AlN DBC production for DBCs with very high thermal conductivity
         for high temperature and performance applications. Development of the
         dimple design for a higher temperature cycle resistance. Development of
         a protective frame for DBC production with multiple up.
1995 Start of AlN DBC production.
1996 Start of production for high performance laser diode coolers by bonding
         copper layers during the DBC process.
1998 Setting up sales branches in Japan and China. Second plant expansion to
         5,900 sqm in Eschenbach.
2003 Start of production of DBC with zirconium doped ceramic to enable the use of
         thick copper.
2004 Development of step etching for a double-sided cooling of power
         semiconductors.
2005 Start of production of PDF (partial discharge free) DBC substrates.
2006 Third plant expansion to 13,000 sqm, approx. 500 employees.
2007 Start of production of 5" x 7" AlN-DBC coolers for large area CPV
         applications (concentrated photovoltaics).
2008 Introduction of partial plating (silver, nickel-gold) for different functional
         surfaces and the low temperature soldering process.
2011 Rogers Corporation acquires 100% of curamik electronics GmbH, expanding
         the global Power Electronics portfolio.