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Copper and ceramic are the basis for unique substrate solutions

The basis of the substrate is a ceramic isolator to which pure copper is applied. The result is ceramic subtrates with high heat conductivity and great capacity and heat spreading provided by the thick copper layer which create high performance specifications of our products for power electronics.

Using high-purity copper, significantly higher ampacity in comparison to alternative technologies can be reached. Another advantage is the low mechanical wear of the unpackaged silicon chips (Chip on Board Design), due to the similar thermal expansion of our substrates and silicon.

Our technology is also used for high performance cooling devices. Inside is a channel structure made of thin copper foils, which is assembled into a hermetically tight block by curamik''s bonding process. This produces a very high copper surface area, enabling efficient liquid cooling.

The most effective cooling is achieved by a combination of ceramic substrates with a cooling block, based on these micro-channel structures, where direct contact of the uncased power chips is made with the water-cooled base plate.