Copper and ceramics are the basis for
unique DBC technology

As indicated by curamik's name, the secret is the unique synthesis of copper and ceramics.

The substrate basis is a ceramic isolator (currently aluminium oxide or aluminium nitride), to which pure copper is applied in a high-temperature melting and diffusion process. The result is an adhesive connection of copper to the ceramics. The name "Direct Bonded Copper " has been given to this product.

In particular the high heat conductivity (up to 180 W/mK), great heat capacity and spread of the thick copper coating (200 - 600 µm) creates the high performance specifications of our products for power electronics.

Using high-purity copper, a unique ampacity in comparison to alternative technologies can be reached. Another advantage is the low mechanical wear of the uncased silicon chips, due to the similar thermal expansion of DBC substrates.

For ten years, this DBC technology is as well used for high performance cooling devices. Inside is a channel structure made of thin copper foils, which is assembled into a hermetically tight block by curamik's bonding process. This produces a highly enlarged copper surface, enabling efficient liquid cooling.

Most effective cooling is achieved by a combination of DBC substrates with a cooling block, based on channel structures, where direct contact of the uncased power chips is made with the water-cooled base plate.