curamik electronics GmbH
Rogers Corporation

DBC Cooler

Micro channel structures made of thin copper foils that are bonded to a hermetically tight block during the curamik bonding process build the heart of our DBC coolers. The specific micro channel structure determines the thermal resistance, pressure loss and flow rate. The coolant is usually led in and drained through openings at the bottom with interference fits over o-rings or screw fittings.

Liquid coolers are an ideal solution for high-power applications. The switching layout on the cooling area can be customised.

Advantages:

// Four times more efficient cooling than traditional module structures
    with liquid cooling
// Lower weight
// Smaller sizes

We differentiate between:

// integrated DBC coolers with bilateral AlN-DBC for high performance
    applications (>3 kW heat dissipation)
// integrated DBC coolers with bilateral Al2O3-DBC for standard applications
    (1-2 kW heat dissipation)
// non-integrated copper coolers as cost-efficient version (single DBC
    substrates equipped with power chips are soldered on)

Vias (front/rear of DBC through the micro channel structure) or isolated feedthroughs are feasible for isolated coolers.

Product information for DBC Coolers

Product information for Laser Diode Coolers

Technical data sheet for Laser Diode Coolers