Integrated DBC Cooler with Al2O3 or AlN
A DBC cooler consists of several layers of structured copper foil and a top and bottom layer made of DBC substrates (Al₂O₃ or AlN). The etched copper layers form the three-dimensional cooling structures.
DBC substrates offer the surface for equipping the components. They enable direct assembly of the components (chip on board) due to their isolation against the cooling circuit. The design of the different layers and the switching layout of the DBC substrate can be adjusted to customer-specific requirements.
The advantage of this process is that no additional soldering or adhesive layers negatively influence the cooler's thermal resistance.
DBC coolers are currently used for cooling high-performance components, laser diodes or solar-cell arrays.
