Explore a new dimension of usability
Data Matrix Code_ individual code content allows full traceability for the entire power module supply chain
Ni and NiAu Plating_ increases wettability of substrate surface_ protects surface from oxidationand environmental conditions
Step Etching_ two different copper levels build cavities and steps_ allows double sided cooling and enables smaller modules
Controlled Surface Roughness_ chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies
Solder Stop_ separates solder areas from wire bond and other functional areas
Organic Surface Protection_ barrier against oxidation to ensure full workability during wire bonding and soldering processes
Ag Plating_ for silver sintering process to increase reliability_ selective Ag plating delivers plating on functional areas only
Partial Discharge Free_ substrates free of partial discharge for power modules > 1,7 kV
Laser-drilled Holes_ isolated holes enable fast and easy mounting of packaged power modules